Patent Assignment
Reel/Frame 032023/0805
Assignment of Assignor's Interest
Recorded: 2014-01-22
Pages: 5
Assignors
LAN, JE-HSIUNG
Executed: 2014-01-13
ZUO, CHENGJIE
Executed: 2014-01-13
YUN, CHANGHAN HOBIE
Executed: 2014-01-13
KIM, JONGHAE
Executed: 2014-01-13
KIM, DAEIK DANIEL
Executed: 2014-01-13
VELEZ, MARIO FRANCISCO
Executed: 2014-01-13
MIKULKA, ROBERT PAUL
Executed: 2014-01-13
MUDAKATTE, NIRANJAN SUNIL
Executed: 2014-01-13
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Properties
(2)
Thick Conductive Stack Plating Process with Fine Critical Dimension Feature Size for Compact Passive on Glass Technology
Thick Conductive Stack Plating Process with Fine Critical Dimension Feature Size for Compact Passive on Glass Technology
Application:
61/845,573 →