Patent Assignment
Reel/Frame 032037/0164
Assignment of Assignor's Interest
Recorded: 2014-01-24
Pages: 4
Assignors
LIN, SHIH-YEN
Executed: 2014-01-23
LIU, YU-CHIH
Executed: 2014-01-23
CHEN, CHIN-LIANG
Executed: 2014-01-23
LIN, WEI-TING
Executed: 2014-01-23
HO, KUAN-LIN
Executed: 2014-01-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
System and Method for Bonding Package Lid