IP Library › Assignment 032059/0297
Patent Assignment
Reel/Frame 032059/0297

Assignment of Assignor's Interest

Recorded: 2014-01-28 Pages: 3
Assignors
KANG, SEOK MIN
Executed: 2014-01-22
KIM, MOO SEONG
Executed: 2014-01-22
Assignee
LG INNOTEK CO., LTD.
SEOUL SQUARE, 541, NAMDAEMUNNO 5-GA, JUNG-GU, SEOUL, 100-714, KOREA, REPUBLIC OF
Covered Property (1)
Apparatus and Method for Fabricating Wafer
Patent: 9,281,188 →
Application: 14/235,354 →
Publication: US 2014/0170838
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 22, 2021
From: LG INNOTEK CO., LTD.
To: LX SEMICON CO., LTD.
Reel/Frame 057875/0011 →