Patent Assignment
Reel/Frame 032060/0129
Assignment of Assignor's Interest
Recorded: 2014-01-28
Pages: 6
Assignors
LEE, WOO-JIN
Executed: 2013-11-01
AHN, SANG-HOON
Executed: 2013-11-01
CHOI, GIL-HEYUN
Executed: 2013-11-01
HONG, JONG-WON
Executed: 2013-11-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Fabricating the Same