Patent Assignment
Reel/Frame 032061/0800
Assignment of Assignor's Interest
Recorded: 2014-01-28
Pages: 6
Assignors
KIM, SUNG-MIN
Executed: 2014-01-12
KANG, JI-SU
Executed: 2014-01-12
LEE, DONG-KYU
Executed: 2014-01-14
CHA, DONG-HO
Executed: 2014-01-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Forming Semiconductor Devices Using Hard Mask Layers