Patent Assignment
Reel/Frame 032078/0858
Change of Name
Recorded: 2013-12-16
Pages: 2
Assignor
TESSERA TECHNOLOGIES IRELAND LIMITED
Executed: 2011-07-13
Assignee
DIGITALOPTICS CORPORATION EUROPE LIMITED
CLIONA, BUILDING ONE, PARKMORE EAST BUSINESS PARK, BALLYBRIT, GALWAY, IRELAND
Covered Property
(1)
Microelectronic Assembly with Multi-Layer Support Structure
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 5, 2013
From: NYSTROM, MICHAEL J.; HUMPSTON, GILES
To: TESSERA, INC.
Reel/Frame 031720/0834 →
Assignment of Assignor's Interest
Dec 12, 2013
From: TESSERA, INC.
To: TESSERA TECHNOLOGIES IRELAND LIMITED
Reel/Frame 032081/0271 →
Assignment of Assignor's Interest
Dec 17, 2013
From: DIGITALOPTICS CORPORATION EUROPE LIMITED
To: INVENSAS CORPORATION
Reel/Frame 031799/0547 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0807 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073508/0758 →