Patent Assignment
Reel/Frame 032092/0440
Assignment of Assignor's Interest
Recorded: 2014-01-30
Pages: 6
Assignors
JIN, JEONG-GI
Executed: 2013-11-28
LEE, HO-JOON
Executed: 2013-11-28
SUE, JI-WOONG
Executed: 2013-11-28
JANG, JOO-HEE
Executed: 2013-11-28
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device, Semiconductor Package, and Electronic System