Patent Assignment
Reel/Frame 032113/0960
Assignment of Assignor's Interest
Recorded: 2014-01-23
Pages: 3
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Hierarchical Wafer Yield Prediction Method and Hierarchical Lifetime Prediction Method