Patent Assignment
Reel/Frame 032118/0034
Assignment of Assignor's Interest
Recorded: 2014-02-03
Pages: 6
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Fabricating Semiconductor Device Having Grooved Source Contact Region