Patent Assignment
Reel/Frame 032121/0238
Assignment of Assignor's Interest
Recorded: 2014-02-03
Pages: 5
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer ceramic electronic component with interposer substrate having double-layered resin/plating terminals