Patent Assignment
Reel/Frame 032127/0729
Assignment of Assignor's Interest
Recorded: 2014-01-28
Pages: 3
Assignor
LEE, HEE KWON
Executed: 2013-12-31
Assignee
SAMSUNG DISPLAY CO., LTD
95, SAMSUNG 2 RO, GIHEUNG-GU, YONGIN-CITY, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Chip-On-Film Package and Display Device Including the Same