IP Library Assignment 032127/0919
Patent Assignment
Reel/Frame 032127/0919

Assignment of Assignor's Interest

Recorded: 2014-02-04 Pages: 2
Assignors
KAGESHIMA, YOSHIAKI
Executed: 2014-01-27
MUTO, DAISUKE
Executed: 2014-01-27
MOMOSE, KENJI
Executed: 2014-01-27
Assignee
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property (1)
Epitaxial Wafer Manufacturing Device and Manufacturing Method
Patent: 9,624,602 →
Application: 14/236,272 →
Publication: US 2014/0230722
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →