IP Library › Assignment 032167/0054
Patent Assignment
Reel/Frame 032167/0054

Assignment of Assignor's Interest

Recorded: 2014-02-04 Pages: 4
Assignors
YEBKA, B.
Executed: 2013-12-17
HOLUNG, J.A.
Executed: 2013-12-16
WONG, TIN-LUP
Executed: 2013-12-17
JAKES, P.J.
Executed: 2014-01-02
PLUNKETT, J.D.
Executed: 2014-01-03
Assignee
LENOVO (SINGAPORE) PTE. LTD.
151 LOORONG CHUAN, #02-01 NEW TECH PARK, SINGAPORE, 556741, SINGAPORE
Covered Property (1)
Thermal Conduction Matrix
Patent: 9,740,252 →
Application: 14/109,774 →
Publication: US 2015/0169015