Patent Assignment
Reel/Frame 032167/0612
Assignment of Assignor's Interest
Recorded: 2014-02-07
Pages: 3
Assignor
SHIH, HSUEH-HAO
Executed: 2014-01-29
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Structure with Through Silicon via and Method for Fabricating and Testing the Same