Patent Assignment
Reel/Frame 032167/0733
Assignment of Assignor's Interest
Recorded: 2014-02-07
Pages: 4
Assignors
HU, DYI-CHUNG
Executed: 2013-12-11
CHEN, MING-CHIH
Executed: 2013-12-11
TSENG, TZYY-JANG
Executed: 2013-12-18
Assignee
UNIMICRON TECHNOLOGY CORP.
NO. 38, HSING PONG RD., KWEI-SAN INDUSTRIAL ZONE,, TAOYUAN, TAIWAN
Covered Property
(1)
Interposed Substrate and Manufacturing Method Thereof