Patent Assignment
Reel/Frame 032203/0963
Assignment of Assignor's Interest
Recorded: 2014-02-12
Pages: 4
Assignors
HUANG, SHIN-YEH
Executed: 2013-12-25
CHANG, KAI-HSIANG
Executed: 2013-12-25
JIANG, CHIH-CHEN
Executed: 2013-12-25
PENG, YI-WEI
Executed: 2013-12-25
LIN, KUAN-YU
Executed: 2013-12-25
TSAI, MING-SHAN
Executed: 2013-12-25
LAI, CHING-LUN
Executed: 2013-12-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN ROAD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Semiconductor Device Structure and Method for Manufacturing the Same