Patent Assignment
Reel/Frame 032215/0767
Assignment of Assignor's Interest
Recorded: 2014-02-13
Pages: 3
Assignors
CHEN, HSIEN-WEI
Executed: 2014-02-10
YU, TSUNG-YUAN
Executed: 2014-02-10
CHENG, MING-DA
Executed: 2014-02-10
LU, WEN-HSIUNG
Executed: 2014-02-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Packaging Devices and Methods of Manufacture Thereof