Patent Assignment
Reel/Frame 032215/0800
Assignment of Assignor's Interest
Recorded: 2014-02-13
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2014-02-05
LIU, CHUNG-SHI
Executed: 2014-02-05
HUANG, CHIH-FAN
Executed: 2014-02-05
LIN, CHIH-WEI
Executed: 2014-02-05
LIN, WEI-HUNG
Executed: 2014-02-05
CHENG, MING-DA
Executed: 2014-02-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices