Patent Assignment
Reel/Frame 032223/0474
Assignment of Assignor's Interest
Recorded: 2014-02-14
Pages: 3
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95404
Covered Property
(1)
Method of Forming High Density, High Shorting Margin, and Low Capacitance Interconnects by Alternating Recessed Trenches
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.