Patent Assignment
Reel/Frame 032238/0638
Assignment of Assignor's Interest
Recorded: 2014-02-18
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2014-02-10
LIU, CHUNG-SHI
Executed: 2014-02-10
HUANG, CHIH-FAN
Executed: 2014-02-10
HUANG, HUI-MIN
Executed: 2014-02-10
LIN, WEI-HUNG
Executed: 2014-02-10
CHENG, MING-DA
Executed: 2014-02-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices