Patent Assignment
Reel/Frame 032243/0032
Assignment of Assignor's Interest
Recorded: 2014-02-19
Pages: 6
Assignors
WOO, CHANG GYU
Executed: 2014-02-12
SHIN, SUNG HO
Executed: 2014-02-04
NAM, JOO YEOP
Executed: 2014-02-04
CHO, KI HONG
Executed: 2014-02-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing Head in Chemical Mechanical Polishing Apparatus and Chemical Mechanical Polishing Apparatus Including the Same