Patent Assignment
Reel/Frame 032245/0618
Assignment of Assignor's Interest
Recorded: 2014-02-19
Pages: 8
Assignors
NAGANO, TOSHIHIKO
Executed: 2014-01-16
SASAKI, TADAHIRO
Executed: 2014-01-16
ABE, KAZUHIDE
Executed: 2014-01-16
YAMADA, HIROSHI
Executed: 2014-01-16
ITAYA, KAZUHIKO
Executed: 2014-01-16
NAKADA, TAIHEI
Executed: 2014-02-06
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN
Covered Property
(1)
Semiconductor Package Having a Cap Unit with Concave Portion and Method of Manufacturing the Same