Patent Assignment
Reel/Frame 032248/0835
Assignment of Assignor's Interest
Recorded: 2014-02-19
Pages: 3
Assignors
HUANG, XIN-HUA
Executed: 2014-02-18
LIU, PING-YIN
Executed: 2014-02-18
CHAO, LAN-LIN
Executed: 2014-02-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Apparatus and Method for Verification of Bonding Alignment