Patent Assignment
Reel/Frame 032256/0245
Assignment of Assignor's Interest
Recorded: 2014-02-20
Pages: 2
Assignors
CHIU, HAN-CHIN
Executed: 2014-02-14
LIN, HSING-LIEN
Executed: 2014-02-14
TSAI, CHENG-YUAN
Executed: 2014-02-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Forming the Same