Patent Assignment
Reel/Frame 032256/0426
Assignment of Assignor's Interest
Recorded: 2014-02-20
Pages: 4
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Wafer Processing Method Including a Filament Forming Step and an Etching Step