IP Library Assignment 032266/0396
Patent Assignment
Reel/Frame 032266/0396

Assignment of Assignor's Interest

Recorded: 2014-02-21 Pages: 7
Assignors
YEH, CHIUNG-HAN
Executed: 2014-01-20
WU, MING-YUAN
Executed: 2014-01-17
THEI, KONG-BENG
Executed: 2014-01-17
CHUANG, HARRY HAK-LAY
Executed: 2014-01-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Integrating a First Contact Structure in a Gate Last Process
Patent: 8,669,153 →
Application: 13/794,621 →
Publication: US 2013/0196496
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 30, 2023
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: ADVANCED MANUFACTURING INNOVATIONS INC.
Reel/Frame 064180/0278 →