IP Library › Assignment 032293/0515
Patent Assignment
Reel/Frame 032293/0515

Assignment of Assignor's Interest

Recorded: 2014-02-25 Pages: 8
Assignors
BOTULA, ALAN B.
Executed: 2014-02-19
LIFSON, MAX L.
Executed: 2014-02-19
SLINKMAN, JAMES A.
Executed: 2014-02-19
VAN KESSEL, THEODORE G.
Executed: 2014-02-19
WOLF, RANDY L.
Executed: 2014-02-19
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Integrated Circuit Heat Dissipation Using Nanostructures
Patent: 9,324,628 →
Application: 14/189,284 →
Publication: US 2015/0243578