Patent Assignment
Reel/Frame 032295/0188
Assignment of Assignor's Interest
Recorded: 2014-02-25
Pages: 3
Assignors
MOMOSE, KENJI
Executed: 2014-02-17
ODAWARA, MICHIYA
Executed: 2014-02-17
MUTO, DAISUKE
Executed: 2014-02-17
KAGESHIMA, YOSHIAKI
Executed: 2014-02-17
Assignee
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Sic Epitaxial Wafer and Method for Manufacturing Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.