IP Library › Assignment 032303/0850
Patent Assignment
Reel/Frame 032303/0850

Assignment of Assignor's Interest

Recorded: 2014-02-26 Pages: 4
Assignors
HORIKIRI, MASASHI
Executed: 2013-05-31
BAI, JIE
Executed: 2013-08-22
Assignee
HENKEL CORPORATION
ONE HENKEL WAY, ROCKY HILL, CONNECTICUT, 06067
Covered Property (1)
Thermosetting Resin Compositions with Low Coefficient of Thermal Expansion
Patent: 8,829,694 →
Application: 13/840,171 →
Publication: US 2014/0264822
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 7, 2014
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 034186/0588 →
Assignment of Assignor's Interest Feb 26, 2015
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 035101/0856 →
Assignment of Assignor's Interest Mar 9, 2022
From: HENKEL IP & HOLDING GMBH
To: HENKEL AG & CO. KGAA
Reel/Frame 059357/0267 →