Patent Assignment
Reel/Frame 035101/0856
Assignment of Assignor's Interest
Recorded: 2015-02-26
Pages: 38
Assignor
HENKEL US IP LLC
Executed: 2015-02-25
Assignee
HENKEL IP & HOLDING GMBH
HENKELSTRASSE 67, DUESSELDORF, 40589, GERMANY
Covered Properties
(116)
Hot Melt Adhesives for Bonding to Sensitive Areas of the Human Body
Patent:
5,559,165 →
Application:
08/512,579 →
Materials for Semiconductor Device Assemblies
Patent:
5,855,821 →
Application:
08/577,256 →
Hot Melt Adhesives and Disposable Products Utilizing the Same
Patent:
5,723,222 →
Application:
08/629,851 →
Methyltrioxorhenium-Urea Hydrogen Peroxide Epoxidation of Olefins
Patent:
5,723,636 →
Application:
08/631,388 →
Hot Melt Adhesive Compositions with Improved Wicking Properties
Patent:
5,685,758 →
Application:
08/631,390 →
High Solids, Maltodextrin-Based Adhesives
Patent:
5,688,845 →
Application:
08/643,643 →
Chemically Derivatized Maltodextrins
Patent:
5,795,397 →
Application:
08/643,644 →
Hot Melt Adhesives Based on Sulfonated Polyesters
Patent:
5,750,605 →
Application:
08/652,072 →
Method of Decreasing Bleed from Organic-Based Formulations and Anti- Bleed Compositions
Patent:
5,783,621 →
Application:
08/664,200 →
Stable High Viscosity Starch Based Adhesive and Method of Preparation
Patent:
5,753,468 →
Application:
08/693,920 →
Starch-Based, Water Resistant Adhesives
Patent:
5,716,441 →
Application:
08/722,786 →
Organosilicon-Containing Compositions Having Enhanced Adhesive Properties
Patent:
5,852,092 →
Application:
08/798,863 →
Organosilicon-Containing Compositions Capable of Rapid Curing at Low Temperature
Patent:
5,859,105 →
Application:
08/798,864 →
Synthesis of Condensation Polymers in Densified Fluids
Patent:
6,174,956 →
Application:
08/800,371 →
Maltodextrin-Based Adhesives
Patent:
5,932,639 →
Application:
08/841,555 →
Flexible Interpenetrating Networks Formed by Epoxy-Cyanate Ester Compositions via a Polyamide
Patent:
5,912,316 →
Application:
08/859,792 →
Adhesive Composition for Bonding a Semiconductor Device
Patent:
5,744,533 →
Application:
08/868,508 →
Hot Melt Adhesives with Compatible Hydroxyl-Containing Ester Waxes
Patent:
5,852,080 →
Application:
08/901,305 →
Adhesives Resistant to Skin-Penetration Enhancers
Patent:
5,916,968 →
Application:
08/918,173 →
Process for Making Lactide Graft Copolymers
Patent:
5,852,117 →
Application:
08/918,879 →
Adhesives with Low Level of Residual Monomers and Process for Manufacturing Same
Patent:
5,990,229 →
Application:
08/928,313 →
Method of Decreasing Bleed from Organic-Based Formulations and Anti-Bleed Compositions
Patent:
5,859,110 →
Application:
08/935,575 →
Fast Setting Polyurethane Hot Melt Adhesive Composition Comprising Low Hydroxyl Number/High Molecular Weight Polyester Diols
Patent:
5,939,488 →
Application:
08/951,055 →
Enhancer Tolerant Pressure Sensitive Adhesives for Transdermal Drug Delivery
Patent:
6,077,527 →
Application:
08/958,862 →
Use of Low Toxicity Solvents in Waterborne Adhesives
Patent:
6,103,388 →
Application:
09/010,082 →
Adhesive Composition with Small Particle Size for Microelectronic Devices
Patent:
6,022,616 →
Application:
09/012,354 →
Low Application Temperature Hot Melt Adhesive
Patent:
6,117,945 →
Application:
09/018,634 →
Reactive Radiation- or Thermally-Initiated Cationically-Curable Epoxide Monomers and Compositions Made from Those Monomers
Patent:
5,962,547 →
Application:
09/078,768 →
Underfill Encapsulant Compositions for Use in Electronic Devices
Patent:
6,063,828 →
Application:
09/110,047 →
Method of Making an Electronic Component Using Reworkable Underfill Encapsulants
Patent:
6,057,381 →
Application:
09/110,080 →
Long and Short-Chain Cycloaliphatic Epoxy Resins with Cyanate Ester
Patent:
6,057,402 →
Application:
09/133,507 →
Multireactivity Polymercaptans, Star Polymers and Methods of Preparation
Patent:
6,201,099 →
Application:
09/190,156 →
Water-Resistant, Viscosity Stable, Alkaline Corrugating Adhesive Composition
Patent:
6,255,369 →
Application:
09/215,821 →
Multipurpose Hot Melt Adhesive
Patent:
6,232,391 →
Application:
09/219,938 →
Adhesive Paste for Semiconductors
Patent:
6,165,613 →
Application:
09/264,999 →
Use of High Hydroxyl Compounds for Water Sensitive Hot Melt Adhesives
Patent:
6,410,627 →
Application:
09/289,025 →
Use of Anionic or Cationic Plasticizers with Sulfonated Polyesters in Hot Melt Formulations
Patent:
6,001,910 →
Application:
09/289,451 →
Low Application Temperature Hot Melt Adhesive for Cigarette Preparation
Patent:
6,568,399 →
Application:
09/299,516 →
Hot Melt Pressure Sensitive Adhesives Based on Compatibilized Blends of Elastomers
Patent:
6,162,859 →
Application:
09/326,856 →
Package Encapsulant Compositions for Use in Electronic Devices
Patent:
6,316,566 →
Application:
09/336,246 →
Epoxy Resin Composition for Bonding Semiconductor Chips
Patent:
6,225,379 →
Application:
09/347,794 →
Low Application Temperature Hot Melt Adhesive
Patent:
7,019,060 →
Application:
09/439,655 →
Method of Making an Electronic Component Uising Reworkable Underfill Encapsulants
Patent:
6,180,187 →
Application:
09/469,479 →
Bioadhesive composition
Patent:
6,284,235 →
Application:
09/502,585 →
Adhesives for Thermally Shrinkable Films or Labels
Patent:
6,649,259 →
Application:
09/515,881 →
Radiation Curable Hot Melt Adhesive
Patent:
6,486,229 →
Application:
09/517,412 →
Water Based Adhesive Composition with Release Properties
Patent:
6,387,475 →
Application:
09/543,692 →
Multipurpose Hot Melt Adheesive
Patent:
6,391,960 →
Application:
09/548,545 →
Die attach adhesives for use in microelectronic devices
Patent:
6,355,750 →
Application:
09/549,639 →
Removing Deacetylase Containmant from Cephalosporin C Acylase Using Cationic Surfactant
Compounds with electron donor and electron acceptor functionality
Patent:
6,300,456 →
Application:
09/573,838 →
Process for making a foamed polysaccharide aqueous-based adhesive
Patent:
6,280,514 →
Application:
09/602,736 →
Modified polysaccharides for aqueous foamable adhesives
Patent:
6,280,515 →
Application:
09/603,155 →
Die Attach Adhesives with Epoxy Compounds or Resins Having Allyl or Vinyl Groups
Patent:
6,750,301 →
Application:
09/611,899 →
Conductive Ink or Paint
Patent:
6,537,359 →
Application:
09/623,378 →
Corrugating Adhesive
Patent:
6,648,955 →
Application:
09/696,799 →
Hot Melt Adhesives for Dermal Application
Cathode Coating Dispersion
Hot Melt Adhesive Composition
Conductive and resistive materials with electrical stability for use in electronics devices
Patent:
6,344,157 →
Application:
09/782,421 →
Rubber-Acrylic Adhesive Formulation
Conductive Materials with Electrical Stability for Use in Electronics Devices
Curable Hot Melt Adhesive for Casemaking
Reactive Hot Melt Adhesive
Solvent-Based Process for Manufacturing Latent Curing Catalysts
Patent:
6,492,437 →
Application:
09/887,450 →
Radiation Curable Adhesive
Package encapsulant compositions for use in electronic devices
Methods for Assembling Thin Semiconductor Die
Two Part Hybrid Adhesive
High Heat Resistant Adhesive and Sealant Compositions
Water Resistant Adhesive and Methods of Use
Acrylic Pressure Sensitive Adhesive Formulation and Articles Comprising Same
Pressure Sensitive Adhesive Compositions and Articles Prepared Using Such Compositions
Reactive Hot Melt Adhesive
Moisture Curable Adhesives
Application:
12/957,842 →
Publication:
US 2011/0126982
Phase Separated Curable Compositions
Moisture-Curable Hot Melt Adhesive
Wax Replacement Specialty Formulated Corrugating Adhesive
Corrugating Adhesive and Use Thereof
Application:
13/190,825 →
Publication:
US 2012/0040144
Starch-Based Adhesive Compositions and Use Thereof
Silicone Acrylic Hybrid Polymer-Based Adhesives
Thermally Reversible Hot Melt Adhesive Composition Containing Multifunctional Diene and Dienophile Compounds
Low Application Temperature Hot Melt Adhesive
Low Application Temperature Hot Melt Adhesive
Pharmaceutical Pellets Comprising Modified Starch and Therapeutic Applications Therefor
Application:
13/454,592 →
Publication:
US 2012/0207823
Method and System for Regulating Adhesive Application
Moisture Cure Hot Melt Adhesives
Cationic Uv-Crosslinkable Acrylic Polymers for Pressure Sensitive Adhesives
Adhesive Compositions and Use Thereof
Application:
13/617,440 →
Publication:
US 2014/0079897
Silicone-Acrylic Copolymer
Radiation Curable Temporary Laminating Adhesive for Use in High Temperature Applications
Moisture Curable Polyacrylates
Patent:
8,729,179 →
Application:
13/738,348 →
Internal Mold Release Agents for Polyurethane Materials
Application:
13/770,295 →
Publication:
US 2014/0232041
LOW APPLICATION TEMPEARATURE AMORPHOUS POLY-a-OLEFIN ADHESIVE
Adhesive Having Insulative Properties
Adhesive Compositions and Use Thereof
Adhesive Compostions with Wide Service Temperature Window and Use Thereof
Adhesive Compostions with Wide Service Temperature Window and Use Thereof
Application:
13/795,403 →
Publication:
US 2014/0272214
Integral Hot Melt Adhesive Packaging Films and Use Thereof
Process for Preparing Flowable Amorphous Poly-Alpha Olefin Adhesive Pellets
Hot Melt Assist Waterborne Adhesives and Use Thereof
Molding and Overmolding Compositions for Electronic Devices
Waterborne Adhesives for Reduced Basis Weight Multilayer Substrates and Use Thereof
Silver Sintering Compositions with Fluxing or Reducing Agents for Metal Adhesion
Film for Filling Through Hole Interconnects and Post Processing for Interconnect Substrates
Application:
13/827,698 →
Publication:
US 2013/0267089
Stretch Film Lamination Adhesive
Application:
13/832,917 →
Publication:
US 2013/0202902
Prepreg Curing Process for Preparing Composites Having Superior Surface Finish and High Fiber Consolidation
Low Temperature Hot Melt Adhesives for Disposable Articles with High Creep Resistance
Prepreg Curing Process for Preparing Composites Having Superior Surface Finish and High Fiber Consolidation
Reactive Hot Melt Adhesive
Anaerobic Curable Compositions
Two Component Fluid Metering and Mixing System
Thermosetting Resin Compositions with Low Coefficient of Thermal Expansion
Oxetane-Containing Compounds and Compositions Thereof
Application:
13/840,248 →
Publication:
US 2014/0264165
Electronic Devices Assembled with Heat Absorbing and/or Thermally Insulating Composition
Methods and Apparatus for Controlled Single Electron Transfer Living Radical Polymerization
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 21, 2011
From: HARIHARAN, DEEPAK; BRADEL, ROMAN; CHANDRAN, RAMA; KUKKALA, PRAVIN
To: NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION
Reel/Frame 025987/0407 →
Merger
Mar 21, 2011
From: NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION
To: HENKEL CORPORATION
Reel/Frame 025988/0374 →
Assignment of Assignor's Interest
Sep 25, 2014
From: EDEN, JAMES L.; SHI, YONG-CHENG; NESIEWICZ, RUSSELL J.; WIECZOREK, JR., JOSEPH
To: NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION
Reel/Frame 033814/0126 →
Merger
Sep 26, 2014
From: NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION
To: HENKEL CORPORATION
Reel/Frame 033825/0960 →
Assignment of Assignor's Interest
Nov 7, 2014
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 034186/0588 →