Electronic devices assembled with heat absorbing and/or thermally insulating composition

1. A consumer electronic article of manufacture comprising:

(A) A housing comprising at least one substrate having an interior surface and an exterior surface;

(B) A heat absorbing and/or thermally insulating composition, said composition disposed on a metallic or graphite substrate which itself is disposed on at least a portion of the interior surface of the at least one substrate wherein the heat absorbing and/or thermally insulating composition comprises:

a matrix comprised of a thermoplastic or an acrylic emulsion; and

heat absorbing and/or thermally insulating elements dispersed therein; and

(C) At least one semiconductor package comprising an assembly comprising at least one of I.

a semiconductor chip;

a heat spreader; and

a thermal interface material therebetween, or II.

a heat spreader;

a heat sink; and

a thermal interface material therebetween.

2. The article of claim 1 , further comprising a venting element to disperse generated heat from the semiconductor assembly from the article.

3. The article of manufacture of claim 1 , wherein the housing comprises at least two substrates.

4. The article of manufacture of claim 1 , wherein the housing comprises a plurality of substrates.

5. The article of manufacture of claim 1 , wherein the substrates are dimensioned and disposed to engage one another.

6. The article of manufacture of claim 1 , wherein the heat absorbing and/or thermally insulating composition of (B) is disposed on at least a portion of the interior surface of the at least one substrate, the complementary exterior surface of which comes into contact with the end user when in use.

7. The article of manufacture of claim 1 , wherein the heat absorbing and/or thermally insulating elements in the heat absorbing and/or thermally insulating composition of (B) comprise a gas.

8. The article of manufacture of claim 1 , wherein the heat absorbing and/or thermally insulating elements in the heat absorbing and/or thermally insulating composition of (B) comprise air.

9. The article of manufacture of claim 1 , wherein the heat absorbing and/or thermally insulating elements in the heat absorbing and/or thermally insulating composition of (B) comprise a gas within a hollow sphere-like vessel.

10. The article of manufacture of claim 1 , wherein the heat absorbing and/or thermally insulating elements are used at a concentration within the range of 25% to 99% by volume in the heat absorbing and/or thermally insulating composition.

11. The article of manufacture of claim 1 , wherein the heat absorbing and/or thermal insulating composition facilitates the transfer of heat from an electronic component to a heat sink.

12. The article of manufacture of claim 1 , wherein the thermal interface material has a melting point of approximately 37° C.

13. The article of manufacture of claim 1 , wherein the thermal interface material has a melting point of approximately 30° C.

14. The article of manufacture of claim 1 , wherein the thermal interface material has a melting point of approximately 51° C.

15. The article of manufacture of claim 1 , wherein the thermal interface material has a melting point of approximately 60° C.

16. The article of manufacture of claim 1 , wherein the thermal interface material has a thermal impedance (° C. cm 2 /Watt) of less than 0.2.

17. The article of manufacture of claim 1 , wherein the article is a notebook personal computer, tablet personal computer or a handheld device.

18. A composition disposed on a metallic or graphite substrate, said composition comprising:

a matrix; and

heat absorbing and/or thermally insulating elements dispersed therein, wherein the matrix comprises a thermoplastic or an acrylic emulsion.