IP Library Granted Patent US 8,426,986
Granted Patent B2
US 8,426,986 · App. 13/106,967 · Granted Apr 23, 2013

Phase separated curable compositions

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Quick Facts
Patent No.
US 8,426,986
App. No.
13/106,967
Granted
Apr 23, 2013
Kind
B2
Abstract

A curable composition, suitable for underfill encapsulant, has two distinct phase domains after cure, a continuous phase and a discontinuous phase, in which one phase has a modulus value of 2 GPa or greater, and the second phase has a modulus value at least 1 Gpa less than the first phase, characterized in that the phases are generated in situ as the composition cures.

Claims (3)

1. A curable composition, which upon curing generates two phases in situ, the first phase comprising cyanate ester resin or an epoxy resin or both, the first phase after cure having a modulus value of 2 GPa or greater and the second phase comprising an oligomeric material having a weight average molecular weight in the range of 500 to 5000, a maleimide, a cyanate ester resin, an epoxy resin, or both a cyanate ester resin and an epoxy resin, the second phase after cure having a modulus value at least 1 Gpa less than the modulus value of the first phase after cure.

2. A cured composition comprising two phases generated in situ, in which the first phase comprises cyanate ester resin or an epoxy resin or both and has a modulus value of 2 GPa or greater and the second phase comprises an oligomeric material having a weight average molecular weight in the range of 500 to 5000, a maleimide, a cyanate ester resin, an epoxy resin or both a cyanate ester resin and an epoxy resin and has a modulus value at least 1 GPa less than the modulus value of the first phase.

3. The cured composition according to claim 2 in which the phases are generated in situ by reaction induced phase separation or by crystallization induced phase separation.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2015
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 035101/0856 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2014
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 034186/0588 →