Curable hot melt adhesive for casemaking
View Patent ↗A curable casemaking adhesive, books and related articles bound thereby. In one embodiment, a UV curable hot melt adhesive is used to form the case, which is preferably also embossed. In another embodiment, a moisture curable hot melt adhesive is used to form the case, which is preferably also embossed.
1. A case for a hard cover book comprising a radiation curable hot melt adhesive.
2. The case of claim 1 wherein the radiation curable hot melt adhesive is a UV curable hot melt adhesive.
3. The case of claim 1 wherein the adhesive comprises at least one block copolymer comprising a high vinyl styrene-butadiene-styrene block copolymer and a photoinitiator.
4. The case of claim 3 wherein the block copolymer is a radial block copolymer.
5. The case of claim 3 wherein the block copolymer is a linear block copolymer.
6. The case of claim 1 wherein the adhesive comprises a mono epoxidized mono hydrated diene polymer and a photoinitiator.
7. The case of claim 1 which as embossed.
8. The case of claim 1 comprising cover boards and a porous cover stock.
9. A method of forming a case for a hard cover book comprising bonding cover boards to cover stock material using a radiation curable hot melt adhesive.
10. The method of claim 9 wherein the radiation curable hot melt adhesive is a UV curable hot melt adhesive.
11. The method of claim 9 wherein the adhesive comprises at least one block copolymer comprising a high vinyl styrene-butadiene-styrene block copolymer and a photoinitiator.
12. The method of claim 11 wherein the block copolymer is a radial block copolymer.
13. The method of claim 11 wherein the block copolymer is a linear block copolymer.
14. The method of claim 9 wherein the adhesive comprises a mono epoxidized mono hydrated diene polymer and a photoinitiator.
15. The method of claim 9 further comprising embossing the formed case.
16. A method of claim 9 wherein the cover stock material is a porous cover stock material.