IP Library Granted Patent US 6,350,838
Granted Patent Utility
US 6,350,838 · Confirmation No. 7162

Package encapsulant compositions for use in electronic devices

Inventors: Bodan Ma, Quinn K. Tong
⬇ PDF
Code Description Pages PDF
2001-06-28 TRNA Transmittal of New Application 2 View
2001-06-28 A.PE Preliminary Amendment 37 View
2001-06-28 SPEC Specification 40 View
2001-06-28 CLM Claims 18 View
2001-06-28 ABST Abstract 1 View
2001-06-28 OATH Oath or Declaration filed 4 View
2001-06-28 LET. Miscellaneous Incoming Letter 1 View
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Quick Facts
Patent No.
US 6,350,838
App. No.
09/894,540
Filed
2001-06-28
Granted
2002-02-26
Pub. No.
US20010056162A1
Art Unit
1713
PTA
0 days