Moisture-curable hot melt adhesive
View Patent ↗A moisture-curable hot-melt adhesive having an excellent balance of environmental friendliness, compatibility of ingredients, early-stage adhesive strength, heat resistance after moisture curing, tack free time, etc. and a method of manufacture for this hot-melt adhesive. A moisture-curable hot-melt adhesive which contains a urethane polymer that has a terminal isocyanate group and a moisture-curable hot-melt adhesive that contains urethane modified resin, has a residual percentage of isocyanate compound of 5 wt. % or less, and has a heat-resistant softening temperature after moisture curing of 60° C. or higher, has an excellent balance of the aforementioned. Urethane modified resin can be obtained by reacting a resin derivative that has a hydroxyl group with an isocyanate compound, and a moisture-curable hot-melt adhesive can be produced by mixing urethane-modified resin, polymer, and isocyanate compound. The adhesive is particularly useful for building materials, electronics materials, the automotive field, and the like.
1. A moisture-curable hot-melt adhesive comprising:
a prepolymer that has a terminal isocyanate group, and
a urethane modified resin,
wherein the adhesive has a residual percentage of isocyanate compound of 5.0 wt % or less, and has a heat resistance softening temperature after curing of 60° C. or higher.
2. The moisture-curable hot-melt adhesive described in claim 1 above in which the urethane modified resin is obtained by the reaction of a resin derivative that has a hydroxyl group with isocyanate compound.
3. The moisture-curable hot-melt adhesive described in claim 1 above obtained by blending urethane modified resin, polyol, and isocyanate compound.
4. The moisture-curable hot-melt adhesive described in claim 1 above in which the urethane prepolymer is obtained by the reaction of polyol and isocyanate compound.
5. The moisture-curable hot-melt adhesive described in claim 1 above that additionally comprises thermoplastic resin.
6. The moisture-curable hot-melt adhesive described in claim 1 above in which the urethane modified resin is a urethane modified tackifier.
7. The moisture-curable hot-melt adhesive described in claim 1 above in which the urethane modified resin is one or more of a urethane modified gum resin tackifier, a urethane modified wood resin tackifier, and a urethane modified tall oil resin tackifier.
8. The moisture-curable hot-melt adhesive described in claim 1 above in which the urethane modified resin is selected form at least one of a urethane modified gum resin, a urethane modified wood resin, a urethane modified tall oil resin.
9. The moisture-curable hot-melt adhesive described in claim 1 above in which the urethane modified resin is prepared by reaction of an isocyanate compound and at least one of a gum resin derivative having a hydroxyl group, a wood resin derivative having a hydroxyl group, and a tall oil resin derivative having a hydroxyl group.
10. The moisture-curable hot-melt adhesive described in claim 1 above in which the urethane modified resin is prepared by reaction of at least one of gum resin, wood resin, and tall oil resin with a polyhydric alcohol to form an ester and reaction of the ester with an isocyanate compound.