Radiation curable temporary laminating adhesive for use in high temperature applications
View Patent ↗A radiation curable temporary laminating adhesive composition for use in temperature applications at 150° C. or greater, and typically at 200° C. or greater, comprises (A) a hydrogenated polybutadiene diacrylate; (B) a radical photoinitiator; and (C) a diluent.
1. A radiation curable laminating adhesive composition for use in high temperature applications comprising:
(A) an hydrogenated polybutadiene acrylate with no urethane linkage having a number average molecular weight of about 500 to about 10,000;
(B) a radical photoinitiator capable of initiating polymerization at wavelengths of 300 nm and above, selected from the group consisting of alpha-aminoketones and mono-acylphosphine oxides;
(C) a diluent selected from the group consisting of a monofunctional low polarity acrylate having 6-14 carbons in a linear or branched alkyl chain, and a non-polar linear or branched alkane with a boiling point ranging from 95° to 200° C.
2. The composition of claim 1 further comprising an adhesion promoter.
3. A flexible substrate adhered to a rigid substrate with an adhesive comprising:
(A) an hydrogenated polybutadiene acrylate with no urethane linkage having a number average molecular weight of about 500 to about 10,000;
(B) a radical photoinitiator capable of initiating polymerization at wavelengths of 300 nm and above, selected from the group consisting of alpha-aminoketones and mono-acylphosphine oxides;
(C) a diluent selected from the group consisting of a monofunctional low polarity acrylate having 6-14 carbons in a linear or branched alkyl chain, and a non-polar linear or branched alkane with a boiling point ranging from 95° to 200° C.
4. The composition of claim 3 further comprising an adhesion promoter.
5. A plastic thin-film transistor backplane manufactured at temperatures greater than 150° C. using a laminating adhesive comprising:
(A) an hydrogenated polybutadiene acrylate with no urethane linkage having a number average molecular weight of about 500 to about 10,000;
(B) a radical photoinitiator capable of initiating polymerization at wavelengths of 300 nm and above, selected from the group consisting of alpha-aminoketones and mono-acylphosphine oxides;
(C) a diluent selected from the group consisting of a monofunctional low polarity acrylate having 6-14 carbons in a linear or branched alkyl chain, and a non-polar linear or branched alkane with a boiling point ranging from 95° to 200° C.
6. The composition of claim 5 further comprising an adhesion promoter.
7. A method for temporarily adhering a plastic substrate to a rigid substrate comprising:
laminating the plastic substrate and a rigid substrate with an adhesive composition, the adhesive comprising
(A) an hydrogenated polybutadiene acrylate with no urethane linkage having a number average molecular weight of about 500 to about 10,000;
(B) a radical photoinitiator capable of initiating polymerization at wavelengths of 300 nm and above, selected from the group consisting of alpha-aminoketones and mono-acylphosphine oxides;
(C) a diluent selected from the group consisting of a monofunctional low polarity acrylate having 6-14 carbons in a linear or branched alkyl chain, and a non-polar linear or branched alkane with a boiling point ranging from 95° to 200° C.
8. The method of claim 7 wherein the adhesive composition further comprises an adhesion promoter.
9. The method of claim 7 further comprising
photocuring and aging said adhesive composition laminated to the plastic and rigid substrate; and
peeling said plastic substrate off of the rigid substrate.
10. The method of claim 9 wherein aging said adhesive composition occurs at temperatures equal to or greater than 150° C.
11. The method of claim 9 wherein aging said adhesive composition occurs at temperatures equal to or greater than 200° C.
12. A radiation curable laminating adhesive composition for use in high temperature applications consisting essentially of:
(A) an hydrogenated polybutadiene acrylate with no urethane linkage having a number average molecular weight of about 500 to about 10,000;
(B) a radical photoinitiator capable of initiating polymerization at wavelengths of 300 nm and above, selected from the group consisting of alpha-aminoketones and mono-acylphosphine oxides;
(C) a diluent selected from the group consisting of a monofunctional low polarity acrylate having 6-14 carbons in a linear or branched alkyl chain, and a non-polar linear or branched alkane with a boiling point ranging from 95° to 200° C.