IP Library Granted Patent US 8,877,305
Granted Patent B2
US 8,877,305 · App. 13/361,197 · Granted Nov 4, 2014

Low application temperature hot melt adhesive

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Quick Facts
Patent No.
US 8,877,305
App. No.
13/361,197
Granted
Nov 4, 2014
Kind
B2
Abstract

High temperature performance hot melt adhesives are formulated for application at low temperature, i.e., below 300° F. Hot melt adhesive formed with metallocene polymer together with a maleated polyethylene wax show an excellent balance of high and low temperature performance and are particularly useful as packaging case and carton adhesive.

Claims (19)

1. A low application temperature hot melt adhesive comprising a polyolefin copolymer component and a maleated polyethylene wax component,

wherein said polyolefin copolymer component comprises two different polyolefin copolymers comprising:

(A) a first polyolefin copolymer that (i) is a metallocene-catalyzed ethylene/α-olefin copolymer prepared from ethylene and 1-octene monomers, and (ii) has a Melt Index of greater than about 400 g/10 min at 190° C.; and

(B) a second polyolefin copolymer that (i) has at least about 50 mol % of ethylene content and (ii) has a Melt Index less than about 35 g/10 min at 190° C.

2. The adhesive of claim 1 wherein the first polyolefin copolymer has a Melt Index greater than about 500 g/10 min at 190° C.

3. The adhesive of claim 1 , wherein the second polyolefin copolymer is an ethylene-octene-based olefin block copolymer.

4. The adhesive of claim 1 , wherein the second polyolefin copolymer is a random ethylene-octene-based copolymer.

5. The adhesive of claim 1 further, wherein the second polyolefin copolymer comprises at least 60 mol % of ethylene content.

6. The adhesive of claim 1 further, wherein the second polyolefin copolymer is a metallocene-catalyzed polymer.

7. The adhesive of claim 3 wherein the ethylene-octene-based olefin block copolymer has a melting point of 118-122° C.

8. The adhesive of claim 4 , the random ethylene-octene-based copolymer has a melting point of 38-104° C.

9. A low application temperature hot melt adhesive comprising less than 30 wt % of by weight of a polyolefin copolymer component and less than 10% by weight of a maleated polyethylene wax component;

wherein the polyolefin copolymer component comprises two polyolefin copolymers;

wherein the first polyolefin copolymer (1) is a metallocene-catalyzed ethylene/α-olefin copolymer prepared from ethylene and 1-octene monomers; and (2) has a Melt Index of greater than about 400 g/10 min at 190° C., and

wherein the adhesive has a viscosity at 120° C. of below about 3000 centipoises.

10. The adhesive of claim 9 comprising from 25 to 30 wt % of said polyolefin copolymer component and from 5-10 wt % of said maleated polyethylene wax component.

11. The adhesive of claim 10 further comprising a wax component different from said maleated polyethylene wax component.

12. A packaged article comprising the hot melt adhesive of claim 9 , which is a carton, case, tray or bag.

13. The packaged article of claim 12 which is a packaged food article.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2022
From: HENKEL IP & HOLDING GMBH
To: HENKEL AG & CO. KGAA
Reel/Frame 059357/0267 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2015
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 035101/0856 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2014
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 034186/0588 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2014
From: PATEL, JAGRUTI B.; EODICE, ANDREA KEYS; LOW, YEW GUAN
To: HENKEL CORPORATION
Reel/Frame 033814/0533 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 15, 2014
From: PATEL, JAGRUTI B; EODICE, ANDREA KEYS; LOW, YEW GUAN
To: HENKEL CORPORATION
Reel/Frame 033738/0236 →