Patent Assignment
Reel/Frame 032309/0800
Assignment of Assignor's Interest
Recorded: 2014-02-27
Pages: 6
Assignors
PARK, JINTAEK
Executed: 2013-12-26
PARK, YOUNGWOO
Executed: 2013-12-26
LEE, JAEDUK
Executed: 2013-12-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Including Word Line Interconnecting Structures