Patent Assignment
Reel/Frame 032314/0615
Assignment of Assignor's Interest
Recorded: 2014-02-27
Pages: 10
Assignors
DUSEMUND, CLAUS, DR.
Executed: 2014-02-21
SCHONLEBER, MARTIN, DR
Executed: 2013-08-29
MICHELT, BERTHOLD, DR
Executed: 2013-08-29
DIETZ, CHRISTOPH
Executed: 2013-08-29
Assignee
PRECITEC OPTRONIK GMBH
SCHLEUSSNERSTRASSE 54, NEU-ISENBURG, 63263, GERMANY
Covered Property
(1)
Monitoring Apparatus and Method for in-Situ Measurement of Wafer Thicknesses for Monitoring the Thinning of Semiconductor Wafers and Thinning Apparatus Comprising a Wet Etching Apparatus and a Monitoring Apparatus