Patent Assignment
Reel/Frame 032315/0027
Assignment of Assignor's Interest
Recorded: 2014-02-27
Pages: 3
Assignors
ZHAI, JUN
Executed: 2014-02-27
YANG, YIZHANG
Executed: 2014-02-27
PANG, MENGZHI
Executed: 2014-02-27
Assignee
APPLE INC.
1 INFINITE LOOP, CUPERTINO, CALIFORNIA, 95014
Covered Property
(1)
Thermally Enhanced Wafer Level Fan-Out POP Package