IP Library › Assignment 032319/0700
Patent Assignment
Reel/Frame 032319/0700

Assignment of Assignor's Interest

Recorded: 2014-02-28 Pages: 7
Assignors
MOLZER, WOLFGANG
Executed: 2013-09-11
GOETZ, EDMUND
Executed: 2013-09-19
MAHNKOPF, REINHARD
Executed: 2013-08-26
MEMMLER, BERND
Executed: 2013-08-16
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property (1)
Package Vias for Radio Frequency Antenna Connections
Patent: 9,252,077 →
Application: 14/037,213 →
Publication: US 2015/0084194