IP Library › Assignment 032328/0153
Patent Assignment
Reel/Frame 032328/0153

Assignment of Assignor's Interest

Recorded: 2014-02-28 Pages: 4
Assignor
SUSS MICROTEC, INC.
Executed: 2014-02-26
Assignee
SUSS MICROTEC LITHOGRAPHY GMBH
SCHLEISSHEIMER STR. 90, GARCHING, 85748, GERMANY
Covered Properties (2)
Debonding Temporarily Bonded Semiconductor Wafers
Patent: 8,950,459 →
Application: 13/662,307 →
Publication: US 2013/0048224
Debonding Temporary Bonded Semiconductor Wafers
Application: 61/552,140 →
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 13, 2012
From: GEORGE, GREGORY; ROSENTHAL, CHRISTOPHER
To: SUSS MICROTEC INC.
Reel/Frame 028777/0840 →
Assignment of Assignor's Interest Feb 15, 2013
From: GEORGE, GREGORY; ROSENTHAL, CHRISTOPHER
To: SUSS MICROTEC INC.
Reel/Frame 029819/0873 →