IP Library › Patent Application 61552140
Patent Application Provisional
App. No. 61/552,140 · Confirmation No. 8295

Debonding Temporary Bonded Semiconductor Wafers

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2011-11-16 APP.FILE.REC Filing Receipt 3 View
2011-10-27 DRW.NONBW Drawings-other than black and white line drawings 4 View
2011-10-27 SPEC Specification 140 View
2011-10-27 TR.PROV Provisional Cover Sheet (SB16) 3 View
2011-10-27 WFEE Fee Worksheet (SB06) 2 View
2011-10-27 N417 Electronic Filing System Acknowledgment Receipt 2 View
2011-10-27 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
2011-10-27 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
0001-01-03 DRW.SUPP Drawings-black and white line and/or other drawings — View
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Quick Facts
App. No.
61/552,140
Filed
2011-10-27