Assignment of Assignor's Interest

Recorded: 2014-02-25 Pages: 2

Assignors

HIROSE, YOSHIRO

Executed: 2014-02-19

YAMAMOTO, RYUJI

Executed: 2014-02-25

Assignee

HITACHI KOKUSAI ELECTRIC INC.

14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-8980, JAPAN

Covered Property (1)

Method for Manufacturing Semiconductor Device, Method for Processing Substrate, Substrate Processing Apparatus and Recording Medium

Patent: 9,165,761 →

Application: 14/240,897 →

Publication: US 2014/0342573

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.