Patent Assignment
Reel/Frame 032342/0156
Assignment of Assignor's Interest
Recorded: 2014-03-04
Pages: 5
Assignors
ADKISSON, JAMES W.
Executed: 2014-02-24
AMOAH, YOBA
Executed: 2014-02-24
GAMBINO, JEFFREY P.
Executed: 2014-02-25
LEGGETT, CHRISTINE A.
Executed: 2014-02-24
LIFSON, MAX L.
Executed: 2014-02-24
MUSANTE, CHARLES F.
Executed: 2014-02-24
SAMALA, SRUTHI
Executed: 2014-02-24
THOMAS, DAVID C.
Executed: 2014-02-25
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Methods of Forming a Tsv Wafer with Improved Fracture Strength