Patent Assignment
Reel/Frame 032342/0654
Assignment of Assignor's Interest
Recorded: 2014-02-18
Pages: 3
Assignee
SEIKO INSTRUMENTS INC.
8, NAKASA 1-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, JAPAN
Covered Property
(1)
Method of Manufacturing Resin-Encapsulated Semiconductor Device, and Lead Frame
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.