Patent Assignment
Reel/Frame 032359/0468
Assignment of Assignor's Interest
Recorded: 2014-03-05
Pages: 4
Assignors
YANG, SEUNG TAEK
Executed: 2014-02-20
KIM, JONG HOON
Executed: 2014-02-20
OH, TAE KEUN
Executed: 2014-02-20
NA, SONG
Executed: 2014-02-20
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON, 467-734, KOREA, REPUBLIC OF
Covered Property
(1)
Stack Packages Including Diffusion Barriers Over Sidewalls of Through via Electrodes and Methods of Manufacturing the Same