IP Library › Assignment 032369/0274
Patent Assignment
Reel/Frame 032369/0274

Assignment of Assignor's Interest

Recorded: 2014-03-06 Pages: 4
Assignors
LIN, WEI-HUNG
Executed: 2014-03-06
LIN, HSIU-JEN
Executed: 2014-03-04
CHENG, MING-DA
Executed: 2014-03-03
LIANG, YU-MIN
Executed: 2014-03-04
CHEN, CHEN-SHIEN
Executed: 2014-03-04
LIU, CHUNG-SHI
Executed: 2014-03-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN ROAD, VI, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property (1)
Substrate and Package Structure
Patent: 9,425,157 →
Application: 14/190,360 →
Publication: US 2015/0243620