Patent Assignment
Reel/Frame 032381/0546
Assignment of Assignor's Interest
Recorded: 2014-03-07
Pages: 2
Assignors
MIAO, CHIA-CHUN
Executed: 2014-02-25
LIANG, SHIH-WEI
Executed: 2014-02-24
WU, KAI-CHIANG
Executed: 2014-02-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Solder Ball Protection in Packages