Patent Assignment
Reel/Frame 032391/0070
Assignment of Assignor's Interest
Recorded: 2014-03-10
Pages: 6
Assignors
JUNG, JAE-MIN
Executed: 2013-11-11
CHO, KYONG-SOON
Executed: 2013-11-11
HA, JEONG-KYU
Executed: 2013-11-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Chip-On-Film Package and Device Assembly Including the Same